IVAM Microtechnology Network
Halle 17; C48/7
HARTING 3D-MID solutions are deployed in all areas that involve electronics and are confronted with space and weight problems that call for higher integration levels. Whether in aerospace or lighting technology, the automotive industry, sensor applications or even for consumer goods – today all areas present salient examples of 3D-MID applications. As a full-line provider, HARTING offers its customers support throughout the process, from the first idea, on to the prototyping till the series product and its qualification.HARTING MID develops and manufactures 3D-MID and structural electronic components and systems for miniaturization and weight reductions of your electronic or mechatronic device. As your “one-stop shop” for customer specific projects, we provide electrical and mechanical integration in various size packaging. The HARTING technologies offers advanced 3D (free formed) multifunctional packages for MEMS and sensor applications for the automotive industry, telecommunications, medical industry and many other industrial areas.
Standardproducts:
- Component Carrier
- LED-Luminaire
Sensor Technology:
- Light sensor for controlling air conditioning systems
- Sensor carrier for a large format camera
- Position sensor for adaptive cruise control
Antennas:
- Hearing Aids
- RFID Transponder
LED-Lighting:
- Lighting module for a security system
- Lighting module for vehicle interior
Switches:
- Ring switch for caries diagnostics
Security covers:
- Security covers for payment terminals
Development of 3D-MID solutions:
3D-MID (Mechatronic Integrated Devices) offer you the unique opportunity to combine electronic and mechanical functions in one single three-dimensional component. Plastic parts which we make precisely in line with your requirements using injection moulding techniques, and which can be deployed with great flexibility, form the foundation of these capabilities. We then furnish these parts with conductive tracks using laser direct structuring techniques (LDS). This technology offers the greatest degree of design freedom as it makes maximum use of the three-dimensional space available. The associated integration of mechanical and electronic functions in extremely tight confines saves space and supports the process of miniaturization.
