Hall 8a, booth H23.5
Fraunhofer IZM works on advanced integration techniques for innovative medical devices. Applications range from ultraminiaturized implants, cardiovascular diagnotic catheters to wearables for multisensor monitoring. The reasearchers uses high end processes like flex circuit integration, stretchable electronics and wafer level high density integration to enable next generation medical electronics. Sensors and wireless interfaces complement these technologies. Risk analysis and biocompatibility assessment ensure compliance with the MDR.The Fraunhofer Institute for Reliability and Microintegration focuses on microsystem integration, heterosystems, micromechatronics, reliability, wafer level packaging, micro assembly technologies
service provider for microsystems
R&D service, process transfers, reliability evaluations, failure analysis, prototype development, system integration concepts