Focus on intelligent implants: virtual COMPAMED Innovation Forum showcases medical technology innovations

The significance of cutting-edge technologies in medical technology, particularly smart implants, takes center stage at this year's COMPAMED Innovation Forum. Under the theme "Smart Implant Technology: Innovative Production and Future Applications", a webinar will be held on June 3, 2024, bringing together international professionals from the medical technology, supply, and healthcare sectors.

Optimized implant compatibility and innovative manufacturing processes

Smart implants allow for personalized adaptation to optimize compatibility with patients. Advances in manufacturing technology play a key role in their success by continuously enhancing materials and technologies. Significant progress in biocompatibility, durability, and functionality has greatly enhanced the performance and safety of implants.

The future promises even more exciting developments: 3D printing and nanotechnology enable more precise and tailored implants. Artificial intelligence and sensor technology elevate implant monitoring and adaptation to a new level by providing real-time data and enabling automated responses.

The Innovation Forum provides a platform to explore and discuss these exciting developments. International experts from research and industry will speak at the forum and lead discussions on current challenges and future prospects.

Preview of COMPAMED: smart medical technology remains a trending topic

The COMPAMED Innovation Forum annually presents and discusses current medical technology topics by industry leaders to identify current challenges and solutions. The focus is on fostering dialogue between research, industry, and medical practice. The presentations also offer insights into the trending topics of COMPAMED, held annually in autumn in Düsseldorf. The IVAM Microtechnology Network organizes the digital forum in cooperation with Messe Düsseldorf. Registration at a discounted early bird rate is available until April 30.