PHIX B.V.

IVAM Hightech Summit 2025

Leader in assembling Photonic Integrated Circuits (PICs) and electronics into a single package, both for prototyping and customized full-scale production runs. Our assembly services use innovative cutting edge technology supporting all major PIC platforms. We are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules to capitalize on the explosively growing segment of photonics as breakthrough technology for more sustainable data processing, sensing and metrology solutions.

We'd like to connect with customers and development partners for designing & assembling PIC-enabled optoelectronic modules for applications in Telecom, Automotive (like LIDAR systems), Quantum, Industry 4.0, AR/VR, Medical, Space & Defense.

Products

• Customer-specific optoelectronic modules based on photonic integrated circuits, such as tunable lasers, quantum processors, and LIDAR units.
• Optical v-groove fiber arrays with optional spot size converters

Services

• Packaging of photonic integrated circuits in scalable volumes
• Contract manufacturing of production processes such as wafer dicing, die polishing, flip chip hybrid assembly, fiber attachment, wire bonding, and testing