IVAM Microtechnology Network
Hall 8a, booth F35.2
Next Level of Advanced Microelectronics: Development and production services for New Product Integration or Re-Design for medical devices from class 1 to class 3, such as imaging system, applications for daily use in mobile diagnostic and implants. AEMtec provides a wide range of assembly and packaging technologies in cleanroom environment (Wafer Back-End Services, CoB, Flip Chip, SMT) and Box-Build. Through longstanding experience AEMtec has positioned itself as a reliable partner for the manufacture of products with a high level of integrity and reliability. AEMtec is ISO 13485 certified.With certified production facilities according to ISO 13485-2016 standard, AEMtec provides next level technologies for complex, custom (opto-) electronic applications to customer´s specification. The company has a broad portfolio of high-end chip-level technologies, including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Integration and Opto-Packaging for Medical Devices.An extensive suite of development services as well as the production of test equipment and series production capabilities round off the range of services.
The opportunities to optimize processes and eliminate cost drivers must be fully exploited both continously and consistently. For this purpose AEMtec provides a complete service portfolio to ensure ideal conditions. Individual requirements can be serviced and implemented in the shortest periods.Our customers appreciate rapid time-to-market of their product and can therefore secure a competitive advantage. Customers also gain from the various assembly technologies offered from a single source.
