Posts tagged: 3D-MID

Laser direct structuring (LDS) is a special success story. For almost 20 years, it has been possible to apply electronic conductor paths directly onto plastic parts during series production. LDS enables the production of electronic assemblies with flexible geometric shapes. This process enables electronic products, such as smartphones, sensors or medical devices, to become even smaller and more powerful. Automated manufacturing processes also make this process more economically attractive.